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Ansys Launches HFSS Mesh Fusion, Redefines Product Development by Enabling Design of Entire Systems
Ansys new breakthrough technology helps engineers improve product design for advanced applications ranging from autonomous vehicles to 5G communications
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Simulating electromagnetic interference chamber emissions of a touchscreen TV panel including capacitive sensor array
Ansys is empowering engineers to mesh and solve bigger designs than ever thought possible with the launch of Ansys HFSS Mesh Fusion
Slashing development costs and spurring the creation of next-generation products, HFSS Mesh Fusion powers fast and fully-coupled simulation of complex electromagnetic (EM) systems without compromise to the design or fidelity
January 21, 2021
Samsung Foundry Certifies Analog FastSPICE Platform from Siemens for Early Design Starts on 3nm GAA Process Technology
Siemens today announced that its industry-leading tools for the verification of analog/mixed-signal (AMS) circuits are now qualified for early design starts on Samsung Foundry’s new 3nm Gate All Around (GAA) process technology.
With this certification, customers can now verify their early-stage AMS designs using the Analog FastSPICE™ (AFS) platform on Samsung’s most advanced process technology. Samsung’s 3nm GAA platform is engineered to reduce total silicon size, use less power and improve performance over previous process nodes.
“Samsung and Siemens have an established track record of collaboration to enable our mutual customers to fully leverage the AFS platform, and we are pleased that the AFS platform is now certified for early design starts on the very latest Samsung Foundry process,” said Sangyun Kim, Vice President o
December 17, 2020
Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2.5/3D Chip Designs
Proven flow featuring the Celsius Thermal Solver and Clarity 3D Solver accelerates 2.5/3D designs for hyperscale, communications and automotive applications
SAN JOSE, Calif., December 16, 2020 Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Samsung Foundry has certified the complete Cadence® system analysis and advanced packaging design tool flow as a Samsung Multi-Die Integration (MDI™) advanced packaging reference flow. This proven on-/off-chip design flow, which features Cadence multi-physics system analysis tools including the Celsius™ Thermal Solver and Clarity™ 3D Solver, accelerates the planning, implementation, verification and signoff of 2.5D and 3D multi-die chip designs employed in hyperscale computing, 5G communications and automotive applications, particularly those utilizing artificial intelligence (AI). For more
Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2.5/3D Chip Designs
Proven flow featuring the Celsius Thermal Solver and Clarity 3D Solver accelerates 2.5/3D designs for hyperscale, communications and automotive applications
SAN JOSE, Calif.–(BUSINESS WIRE)–Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Samsung Foundry has certified the complete Cadence
® system analysis and advanced packaging design tool flow as a Samsung Multi-Die Integration (MDI
™) advanced packaging reference flow. This proven on-/off-chip design flow, which features Cadence multi-physics system analysis tools including the Celsius
™ Thermal Solver and Clarity
™ 3D Solver, accelerates the planning, implementation, verification and signoff of 2.5D and 3D multi-die chip designs employed in hyperscale computing, 5G communications and automotive applications, particularly those utilizing artificial intelligence (AI). For more informati