Winstek Places Second Order for YES (Yield Engineering Systems, Inc.) VertaCure™ XP
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YES today announced that it will deliver another VertaCure™ XP, the latest version of its flagship VertaCure vacuum curing system, to Winstek Semiconductor Co., Ltd.
“The VertaCure XP system’s enhanced capabilities make it especially well-suited for the demands of ‘Beyond Moore’ advanced packaging, and its ability to handle both 200 mm and 300 mm wafers is ideal for our WLCSP application,” said Cheng-Che Tsou, Director of Bumping Engineering at Winstek. FREMONT, Calif. (PRWEB) April 05, 2021 YES (Yield Engineering Systems, Inc.), a preferred supplier of process equipment for the semiconductor advanced packaging, life sciences and display markets, today announced that it will deliver another VertaCure™ XP, the latest version of its flagship VertaCure vacuum curing system, to Winstek Semiconductor Co.,
YES Secures VertaCure™ XP Volume Purchase Order from Powertech Technology Inc prweb.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from prweb.com Daily Mail and Mail on Sunday newspapers.
YES Receives VertaBond™ Purchase Order from a Tier 1 Memory Manufacturer
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Yield Engineering Systems, Inc. announces that a leading memory manufacturer has ordered the YES VertaBond™ system for wafer-to-wafer and die-to-wafer bonding, utilized in bringing next-generation HBM (high bandwidth memory) to market. This new VertaBond system will enable our valued customer’s most advanced HBM development and pilot production,” said Alex Chow, Asia Sales President & General Manager at YES. FREMONT, Calif. (PRWEB) March 15, 2021 YES (Yield Engineering Systems, Inc.), a preferred provider of material modification and surface enhancement solutions for the semiconductor, life science and display markets, today announced that a leading memory manufacturer has ordered the YES VertaBond™ system for wafer-to-wafer and die-to-wafer bonding. The new system will be utilized in bringing next-generation HBM (h
YES Receives Repeat, Volume VertaCure Order from Major Foundry
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YES announced today that it has received a repeat, volume purchase order from a leading foundry for its VertaCure polyimide curing system and its next-generation VertaCure XP system.
“We are very pleased to support this major advanced packaging expansion, and we look forward to working with this high-profile customer to meet their exciting production and technology roadmap,” said Alex Chow, Asia Sales President & General Manager at YES. FREMONT, Calif. (PRWEB) February 03, 2021 YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and AR/VR applications, today announced that it has received a repeat, volume purchase order from a leading foundry for its VertaCure polyimide curing system and its next-generation VertaCure XP system. The VertaCure systems w