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Intel s Next-Gen 10nm ESF Based Sapphire Rapids Xeon CPU Die Shot Unveils MCM Design & Up To 80 Cores In 4 Chiplets

Apr 30, 2021 03:36 EDT New die shots of Intel s next-gen Sapphire Rapids Xeon CPUs have surfaced which show an MCM design that could house up to 80 cores. The leak comes from Bilibili and shows us an engineering sample of the upcoming chip. Intel Sapphire Rapids Xeon CPU Die Shots Unveils MCM Design With 4 Chiplets We did get a close-up look at Intel s 4th Gen Sapphire Rapids Xeon CPU dies last month but we didn t get to see what s underneath those dies. The leaker managed to expose each of the four chiplet dies on the main interposer. With all four chiplets exposed, we can see that underneath them is a 5x4 core configuration which means each die consists of up to 80 cores. However, the entire 80 core silicon will never be released to the public due to the mesh layout.

Intel 10nm Xeon Sapphire Rapids-SP CPUs To Feature Up To 56 Cores & 350W TDP

Intel 10nm Xeon Sapphire Rapids-SP CPUs To Feature Up To 56 Cores & 350W TDP
wccftech.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from wccftech.com Daily Mail and Mail on Sunday newspapers.

Asgard launches DDR5-4800 RAM for Intel Alder Lake platforms

Little known Chinese manufacturer Asgard, AKA the Shenzhen Jiahe Jinwei Electronic Technology Co., Ltd, has launched its first DDR5 memory module. The new memory module will feature 64GB capacity, is rated at DDR5-4800, and has a JEDEC standard operating voltage of 1.1V and 40-40-40 timings. Rather than delve further into its Norse mythology history books for a product name, Asgard has seen fit to call its first DDR5 product the VMA5AUK-MMH224W3. You will also notice a lack of flair to the memory module design, it looks entirely basic and utilitarian with its sparsely populated green PCB – no heat-sinks, no RGBs, and perhaps it could have even made the module low-profile.

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