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Cadence Receives TSMC OIP Ecosystem Forum Customers’ Choice Award for N3 Collaboration Cadence Design Systems, Inc. has announced that it has received a TSMC Open Innovation Platform® (OIP) Ecosystem Forum Customers’ Choice award for a paper, “Optimized Digital Design, Implementation and Signoff on TSMC’s N3,” which was presented during the TSMC 2020 North America OIP Ecosystem Forum. Cadence’s Yufeng Luo, vice president, R&D in the Digital & Signoff Group, presented the paper, highlighting how engineers creating hyperscale and mobile designs can successfully benefit from the performance and efficiency of the TSMC N3 process technology and the Cadence® digital full flow.

United statesSuk leeYufeng luoEcosystem forumDesign infrastructure management divisionCadence design systems incDigital signoff groupEcosystem forum customer choiceDesign systemsInnovation platformDigital designSignoff groupஒன்றுபட்டது மாநிலங்களில்சூக் லீசுற்றுச்சூழல் அமைப்பு மன்றம்வடிவமைப்பு உள்கட்டமைப்பு மேலாண்மை பிரிவு