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Hardent Joins Samsung SAFE™ IP Partner Program & Launches New Display IP Subsystem Solution in Collaboration with Rambus

MIPI Drives Performance for Next-Generation Displays

MIPI Drives Performance for Next-Generation Displays By Mixel, Rambus, and Hardent In late 2000, Nokia announced its iconic 3310 handset which featured an 84×48-pixel pure monochrome display. Seven years later, Apple unveiled its first iPhone with a 90mm (3.5”) screen and 320×480-pixel resolution (at 163 ppi). Cameras and high-quality displays quickly became the de-facto standard for smartphones by the mid-2000s. However, proprietary interface solutions for connecting cameras and displays to mobile processors lacked the standardization needed to make sense of the chaos of sourcing these components in a rapidly growing mobile phone market. The Mobile Industry Processor Interface (MIPI®) Alliance was formed in 2003 to address the fragmentation in the essential video interface technologies for cameras and displays in phones. In later years, the alliance significantly expanded its scope to publish specifications covering physical layer, multimedia, chip-to-chip, control/data, and

Tektronix delivers automated USB Type-C® compliance and debugging solutions

Share this article Share this article BEAVERTON, Ore., May 13, 2021 /PRNewswire/  To meet consumer demand for ever faster data downloads, from live streaming videos to global videoconferences, Tektronix, Inc. today announces three new testing solutions to help drive the future of data transfers. Tektronix announces three new testing solutions to help drive the future of data transfers. The new transmitter automated test solutions are designed to meet the demanding requirements of next-generation technologies for large, rapid data transfers and low-latency video displays. Tektronix USB4™, Thunderbolt™ 4 and DisplayPort™ 2.0 automated compliance and debugging solutions address the most common challenges design engineers face, including test time, signal integrity and Device Under Test (DUT) control. The solutions also boast physical layer electrical testing and characterization, which is crucial for designers to comply with the next-generation standards over the USB-C conne

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