MicroLEDs continually demonstrate performance benefits for displays, including higher contrast and brightness, greater pixel density and wider color gamut. MicroLEDs facilitate enhanced visual performance in ambient light conditions, from complete darkness to broad daylight and when viewed from multiple viewing angles.
These characteristics make microLEDs particularly attractive for applications including mobile phones and smart-watches, automotive display panels, augmented and mixed reality (AR/MR) headsets and digital signage.
Manufacturing high quality microLED panels is a persistent challenge that often limits production efficiency. Before manufacturers can deliver commercially viable microLED display products, there are certain quality issues to consider.
The Challenge of MicroLED Display Uniformity
Shortages, Challenges Engulf Packaging Supply Chain
Innovative business models emerge, but so does possibility of consolidation.
A surge in demand for chips is impacting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, key components, and equipment.
Spot shortages in packaging surfaced in late 2020 and have since spread to other sectors. There are now a variety of choke points in the supply chain. Wirebond and flip-chip capacity will remain tight throughout 2021, along with a number of different package types. In addition, critical components used in IC packages, namely leadframes and substrates, are in short supply. Recent fires at a packaging substrate factory in Taiwan has made the problems worse. On top of that, wirebonders and other equipment are seeing extended delivery lead times.
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ASE has developed an assembly design kit (ADK) that helps customers using ASE’s Fan Out Chip on Substrate (FOCoS) and 2.5D Middle End of Line (MEOL) technologies to make use of the full Siemens HDAP design flow. ASE and Siemens have extended their partnership to include the future creation of a single design platform from FOWLP to 2.5D substrate design. All of these use the Xpedition Substrate Integrator software and Calibre 3DSTACK platform that Siemens acquired from Mentor Graphics.
“By adopting the Siemens Xpedition Substrate Integrator and Calibre 3DSTACK technologies, and through integration with the current ASE design flow, we can now leverage this mutually developed flow to significantly reduce 2.5D/3D IC and FOCoS package assembly planning and verification cycle times by about 30 to 50 percent in each design iteration,” said Dr. C.P. Hung, vice president, ASE Group. “Through the comprehensive design flow, we can now more quickly and easily co-design with our customer