Senseeker Engineering Acquires SE-IR Corporation
Date Announced: 02 Mar 2021
Senseeker Engineering, a leading innovator of digital infrared image sensing technology, has completed the acquisition of SE-IR Corporation, an industry leader in the field of cryogenic test equipment and electronics. The combination of Senseeker’s advanced digital readout IC technology and SE-IR’s industry standard test Dewars and electronics is a highly complementary amalgam that will enable focal plane array (FPA) developers to expedite their FPA development and evaluation process.
“Senseeker builds solutions that help our customers create higher performance sensors and get them into production faster,” said Kenton Veeder, President at Senseeker Engineering. “Our continued commitment not to sell infrared FPAs is aligned with SE-IR, who has been a strong ecosystem partner to Senseeker and the infrared community for many years. Together we accelerate our customers’ capabilities through expand
Semiconductor Packaging Assembly Process Engineer
Manage the process development procedure to ensure the transfer of process and products from the development phase to production release is completed successfully and on schedule.
Provide effective people management through the provision of coaching/mentoring and appropriate development planning to ensure the retention of key personnel.
Prepare operating budgets to maintain engineering and manufacturing capability to support business demands of the back end. Maintain focus on cost control for all back end activities and proactively encourage cost reduction and lean manufacturing principles.
Lead and participate in engineering activities to specify, support and improve final assembly processes for production including documentation, process controls, training and support
â¬26M round to expand diffractive optics production at NIL Technology
25 Feb 2021
New European Innovation Council Fund takes part in series B effort by Danish maker of optical components.
NIL Technology (NILT), the Copenhagen-based provider of specialist optical components including metalenses, has raised â¬26 million in a new round of venture funding.
The fundraising effort, which including a significant contribution from the new European Innovation Council (EIC) Fund, is set to extend the firmâs mass production capability - alongside efforts to advance new metalens technology and reduce component size and complexity.
NILT, which also offers nanoimprint lithography services, says it has already made inroads into the fast-growing area of 3D sensing inside smart phones. It is now expecting to see that technology proliferate into other applications, including autonomous vehicles.