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Qualcomm Revealed their Next-Gen 3D Sonic Sensor for In-Display Biometrics at CES 2021 Today

Qualcomm Revealed their Next-Gen 3D Sonic Sensor for In-Display Biometrics at CES 2021 Today   In November 2019 Patently Apple posted a report titled Samsung and other Android Smartphone OEMs may be Hesitant to use Qualcomm s Ultrasonic Fingerprint Sensors in 2020. The first generation was quickly adopted by Samsung and it backfired on them with the financial and securities industry when a serious security flaw with discovered. Fourteen months later and Qualcomm has introduced the second generation of their biometrics technology.   Today at CES 2021, Qualcomm Technologies received an Innovation Award for their  3D Sonic Max, the second-generation 3D Sonic Sensor which is now 77 percent larger than its predecessor. Mobile devices with Qualcomm 3D Sonic Max are expected to be available later this year.

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