December 17, 2020
Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2.5/3D Chip Designs
Proven flow featuring the Celsius Thermal Solver and Clarity 3D Solver accelerates 2.5/3D designs for hyperscale, communications and automotive applications
SAN JOSE, Calif., December 16, 2020 Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Samsung Foundry has certified the complete Cadence® system analysis and advanced packaging design tool flow as a Samsung Multi-Die Integration (MDI™) advanced packaging reference flow. This proven on-/off-chip design flow, which features Cadence multi-physics system analysis tools including the Celsius™ Thermal Solver and Clarity™ 3D Solver, accelerates the planning, implementation, verification and signoff of 2.5D and 3D multi-die chip designs employed in hyperscale computing, 5G communications and automotive applications, particularly those utilizing artificial intelligence (AI). For more
Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2.5/3D Chip Designs
Proven flow featuring the Celsius Thermal Solver and Clarity 3D Solver accelerates 2.5/3D designs for hyperscale, communications and automotive applications
SAN JOSE, Calif.–(BUSINESS WIRE)–Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Samsung Foundry has certified the complete Cadence
® system analysis and advanced packaging design tool flow as a Samsung Multi-Die Integration (MDI
™) advanced packaging reference flow. This proven on-/off-chip design flow, which features Cadence multi-physics system analysis tools including the Celsius
™ Thermal Solver and Clarity
™ 3D Solver, accelerates the planning, implementation, verification and signoff of 2.5D and 3D multi-die chip designs employed in hyperscale computing, 5G communications and automotive applications, particularly those utilizing artificial intelligence (AI). For more informati
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Samsung Foundry Adopts Spectre X Simulator for 5nm Design
Cadence Design Systems, Inc. has announced that Samsung Foundry has adopted the Cadence® Spectre® X Simulator for its latest 5nm PCI Express® (PCIe®) PHY IP for automotive, mobile, consumer and healthcare applications. Using the Spectre X Simulator’s multi-core scalability, customers can achieve up to 10X simulation performance gains for large, post-layout designs while maintaining golden accuracy.
Designing at advanced nodes requires parasitic inclusion and simulation to maintain design quality. Samsung Foundry selected the Spectre X Simulator as its plan of record for the foundry design team because it offers the higher capacity analog simulation needed for advanced-node designs, while also increasing performance and maintaining accuracy. Using the simulator’s verification mode setting, Samsung can solve long-standing simulation capacity problems