(0) I-Cube4 incorporates four HBMs and one logic die on a paper-thin silicon interposer, supporting enhanced thermal management as well as stable power supply
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced the immediate availability of its next-generation 2.5D packaging technology Interposer-Cube4 (I-Cube4), leading the evolution of chip packaging technology once again.
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Samsung s I-Cube4 for high-performance applications (Photo: Business Wire)
Samsung s I-Cube
TM is a heterogeneous integration technology that horizontally places one or more logic dies (CPU, GPU, etc.) and several High Bandwidth Memory (HBM) dies on top of a silicon interposer, making multiple dies operate as a single chip in one package.
IBM unveils 2-nanometre chip technology for faster computing.
The technology could be as much as 45% faster than the mainstream 7-nanometre chips in many of today s laptops and phones and up to 75% more power efficient, the company said.
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For decades, each generation of computer chips got faster and more power-efficient because their most basic building blocks, called transistors, got smaller.
The pace of those improvements has slowed, but International Business Machines Corp on Thursday said that silicon has at least one more generational advance in store.
For decades, each generation of computer chips got faster and more power-efficient because their most basic building blocks, called transistors, got smaller. The pace of those improvements has slowed, but International Business Machines Corp on Thursday said that silicon has at least one more generational advance in store.
IBM introduced what it says is the world s first 2-nanometer chipmaking technology. The technology could be as much as 45% faster than the mainstream 7-nanometer chips in many of today s laptops and phones and up to 75% more power efficient, the company said. The technology likely will take several years to come to market. Once a major manufacturer of chips, IBM now outsources its high-volume chip production to Samsung Electronics Co Ltd but maintains a chip manufacturing research center in Albany, New York that produces test runs of chips and has joint technology development deals with Samsung and Intel Corp to use IBM s chipmaking technology.
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