Cadence Receives TSMC OIP Ecosystem Forum Customers’ Choice Award for N3 Collaboration
Cadence Design Systems, Inc. has announced that it has received a TSMC Open Innovation Platform® (OIP) Ecosystem Forum Customers’ Choice award for a paper, “Optimized Digital Design, Implementation and Signoff on TSMC’s N3,” which was presented during the TSMC 2020 North America OIP Ecosystem Forum. Cadence’s Yufeng Luo, vice president, R&D in the Digital & Signoff Group, presented the paper, highlighting how engineers creating hyperscale and mobile designs can successfully benefit from the performance and efficiency of the TSMC N3 process technology and the Cadence® digital full flow.
Synopsys Receives Customers Choice Award for Paper Presented at TSMC 2020 Open Innovation Platform Ecosystem Forum
MOUNTAIN VIEW, Calif., Feb. 9, 2021 /PRNewswire/  Synopsys, Inc. (Nasdaq: SNPS) today announced it received the Customers Choice Award for a technical paper presented at the TSMC 2020 North America Open Innovation Platform
® (OIP) Ecosystem Forum. The paper, titled 5nm Node Enablement and Maximizing QoR Using Fusion Compiler
â¢, was developed and presented by Henry Sheng, group director of Engineering at Synopsys. The paper won the award based on the popular vote by conference attendees and can be downloaded on TSMC.com.  Our customers appreciate Synopsys sharing their technical knowledge and expertise in enabling the next-generation designs in fast-growing mrkets such as 5G, mobile and automotive, said Suk Lee, vice president of the Design Infrastructure Management Division at TSMC. I m pleased to congratulate Synopsys as the winner of th