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Iconic computer chipmaker Intel Corp. is reimagining how it brands its future semiconductor innovations. The company has just announced one of its most ambitious roadmaps ever, unveiling new chip and packaging technologies that it says will help it to reclaim its leadership of the processor space by 2025.
Intel Chief Executive Pat Gelsinger (pictured) said at the company’s Intel Accelerated event today that its future products will no longer use the old nanometer-based naming convention for its new innovations. Rather, it’s moving to a new nomenclature that Gelsinger said would provide “a more accurate view of process nodes across the industry”.