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Worldwide Time-sensitive Networking Industry to 2027 - Featuring Analog Devices, Broadcom & Advanced Micro Devices Among Others

Worldwide Time-sensitive Networking Industry to 2027 - Featuring Analog Devices, Broadcom & Advanced Micro Devices Among Others
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11th Gen Intel Core congatec modules with soldered RAM

11th Gen Intel Core congatec modules with soldered RAM congatec, a specialist in embedded and edge computing technology, has introduced a new 11th Gen Intel Core processor based Computer-on-Module with soldered RAM providing shock and vibration resistance. Designed to withstand even extreme temperature ranges of -40°C to +85°C, the COM Express Type 6 Computer-on-Modules provide full compliance for shock and vibration resistant operation in challenging transportation and mobility applications. congatec is also offering a cost optimised Intel Celeron based shock and vibration resistant variant for the extended temperature range from 0°C to 60°C. These Computer-on-Modules based on the Tiger Lake microarchitecture are suitable for trains, commercial vehicles, construction machines, agricultural vehicles, self-driving robots and many other mobile applications deployed in challenging environments. Shock and vibration resistant stationary devices

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