Page 3 - பதிக்கப்பட்ட தொழில்நுட்பம் News Today : Breaking News, Live Updates & Top Stories | Vimarsana

5 days ago 340 Views Xilinx announced the company has expanded its UltraScale+ portfolio for markets with new applications that require ultra-compact and intelligent edge solutions. With form factors that are 70 percent smaller than traditional chip-scale packaging, the new Artix and Zynq UltraScale+ devices can now address a wider range of applications within the industrial, vision, healthcare, broadcast, consumer, automotive, and networking markets. As the world’s only hardware adaptable cost-optimised portfolio based on 16 nanometer technology, Artix and Zynq UltraScale+ devices are available in TSMC’s state-of-the-art InFO (Integrated Fan-Out) packaging technology. Using InFO, Artix and Zynq UltraScale+ devices meet the need for intelligent edge applications by delivering high-compute density, performance-per-watt, and scalability in compact packaging options.

Xilinx ultrascaleSumit shahZynq ultrascaleDan mandellArtix ultrascaleIntegrated fan outProduct line managementTriton edgeRod barmanSecurity monitorEmbedded technologyசுமிட் ஷாடான் மண்டெல்ஒருங்கிணைந்த விசிறி ஔட்ப்ராடக்ட் வரி மேலாண்மைட்ரைடன் விளிம்பு