Advanced Packaging Market: Increase in demand for miniaturization of devices, drives the growth
tusharJuly 1, 2021
Allied Market Research published a new report, titled, “
Advanced Packaging Market by Type (Flip Chip CSP, Flip-Chip Ball Grid Array, Wafer Level CSP, 2.5D/3D, Fan-Out WLP, and Others), and End Use (Consumer Electronics, Automotive, Industrial, Healthcare, Aerospace & Defense, and Others): Global Opportunity Analysis and Industry Forecast, 2020–2027.”
The report offers an extensive analysis of key growth strategies, drivers, opportunities, key segment, Porter’s Five Forces analysis, and competitive landscape. This study is a helpful source of information for market players, investors, VPs, stakeholders, and new entrants to gain thorough understanding of the industry and determine steps to be taken to gain competitive advantage.
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Microchip achieve JEDEC qualification for RT FPGA in a plastic package Microchip Technology has now given developers of small satellite constellations and other space systems a faster and more economical production path with the first JEDEC qualified Radiation Tolerant (RT) FPGA.
This radiation tolerant FPGA offers the low cost of a JEDEC-qualified plastic package as well as the proven reliability of RTG4 FPGA technology.
âThis is a major milestone for system designers who need large volumes of space-grade components at low unit cost, and reduced lead times so they can keep pace with shorter service launch cycles,â said Ken OâNeill, associate director, space and aviation marketing for Microchipâs FPGA business unit. âThese RTG4 FPGAs have very high standards for reliability and radiation protection, while keeping the cost down using plastic packages and Sub-QML screening.