Saki to Exhibit Latest 3D-SPI and 3D-AOI System Solutions at NEPCON China 2021
Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, will be exhibiting its latest 3D Solder Paste Inspection (SPI) and 3D Automatic Optical Inspection (AOI) systems on two booths at NEPCON China 2021. Visitors to the event are invited to interact with Saki equipment on the FUJI CORPORATION (FUJI) booth #1G60 and on the Shanghai Cent-Sun Electronic Co., Ltd. (CSE) Booth #1J25 where Saki will introduce its new innovative Z-axis optical-head control feature. The thirtieth NEPCON China exhibition will run from April 21 - 23 at the Shanghai World Expo Exhibition and Convention Center.
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