Photo credit: Andrey Popov – adobe.stock.com For three days in June 2021, Virtual Engineering Days presents educational sessions on packaging for cannabis, sustainability, medical devices, smart manufacturing, and other key areas.
Americans are gearing up for in-person events in the near future. But until then, virtual presentations and learning continue to be the go-to solution.
Informa Markets-Engineering, the parent company of
Packaging Digest, is reprising its popular 2020 event: Virtual Engineering Week. This year it’s a shorter agenda. Virtual Engineering Days 2021 runs just three days instead of the full week: June 15-17, Tuesday, Wednesday, and Thursday.
We’ve packed a lot into these days, though. From keynotes and sophisticated, algorithm-driven “matchmaking” to live product demos and exhibitor innovations, attendees will have plenty to see and do.
Incap Provides India Factories Update; Outlook for 2021 Remains Unchanged
Incap announced on 10 May 2021 that it had temporarily closed down its factories in Tumkur until 24 May 2021. The temporary closure was related to Karnataka State Government’s intensified measures against the coronavirus pandemic.
The State Government has extended the intensified measures and the lock-down until 7 June 2021. However, Incap has been granted a permission for partial operations to support the manufacturing of critical electronic equipment including applications for healthcare. Incap continues its close co-operation with the Karnataka State Government and follows the instructions announced. The company expects that the factory will be back to normal operations by 7 June 2021.
Siemens Accelerates Digital Marketplace Strategy with Acquisition of Supplyframe iconnect007.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from iconnect007.com Daily Mail and Mail on Sunday newspapers.
Siemens delivers next-generation, comprehensive hardware-assisted verification system
Siemens Digital Industries Software has recently unveiled its next-generation
Veloce hardware-assisted verification system for the rapid verification of highly sophisticated, next-generation integrated circuit (IC) designs. This is the first complete, integrated offering that combines best-in-class virtual platform, hardware emulation, and Field Programmable Gate Array (FPGA) prototyping technologies and paves the way to leverage the latest powerful hardware-assisted verification methodologies.
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Veloce HYCON (HYbrid CONfigurable) for virtual platform/software-enabled verification. Veloce HYCON delivers innovative technology that allows customers to engineer and deploy complex hybrid emulation systems for their next-generation system-on-chip (SoC) designs.
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Veloce Strato+, a capacity upgrade to the Veloce Strato hardware emulator. With an industry-leading ca
The electronics industry is entering a new era of digital transformation driven by the urgent need for electronic systems companies to overcome three big design challenges product, organizational, and process complexity.