Aerospace Industry Professionals to Virtually Convene at SAE International s AeroTech Digital Summit, March 9-11, 2021
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WARRENDALE, Pa. (PRWEB) January 27, 2021
SAE International announced today that the AeroTech® Digital Summit will take place online on March 9-11, 2021. The three-day digital program will cover critical topics in aerospace and defense, including automation, artificial intelligence, autonomous and unmanned systems, electric and connected aircraft, air taxis and advanced manufacturing.
“The past year brought challenges and disruptions across the aerospace industry, but also opportunities. The AeroTech Digital Summit will again serve as that pivotal point for reconnecting industry, reigniting innovation and service for the next generation of aerospace,” said Frank Bokulich, manager of engineering events at SAE International. “We are pleased to once again offer this digital gathering place for attendees to engage with leaders and fo
Siemens bringing low code company to China The Mendix platform announced plans to expand its technology into the Chinese market.
Made in China. Cardboard boxes with text made in China and chinese flag on the roller conveyor. 3d illustration Getty Images/iStockphoto
Low code platform Mendix announced that it would be making its first foray into China thanks to its parent company Siemens, which has long had a foothold in the Chinese market.
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As low code was beginning to gain prominence worldwide, Siemens bought Mendix in 2018 and began integrating it into the Siemens Digital Industries Software group. Siemens has been working in China since 1872, according to a statement, and said it hoped to involve Mendix in a number of different ways, from IoT and edge computing to AI, automation and more.
January 21, 2021
Samsung Foundry Certifies Analog FastSPICE Platform from Siemens for Early Design Starts on 3nm GAA Process Technology
Siemens today announced that its industry-leading tools for the verification of analog/mixed-signal (AMS) circuits are now qualified for early design starts on Samsung Foundry’s new 3nm Gate All Around (GAA) process technology.
With this certification, customers can now verify their early-stage AMS designs using the Analog FastSPICE™ (AFS) platform on Samsung’s most advanced process technology. Samsung’s 3nm GAA platform is engineered to reduce total silicon size, use less power and improve performance over previous process nodes.
“Samsung and Siemens have an established track record of collaboration to enable our mutual customers to fully leverage the AFS platform, and we are pleased that the AFS platform is now certified for early design starts on the very latest Samsung Foundry process,” said Sangyun Kim, Vice President o