AMD teases next-gen 3D V-Cache stack chiplet prototype, Intel killer
AMD teases their brand new 3D chiplet technology, can have multiple chips stacked on top of each other for next-gen CPU dominance.
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AMD teases their brand new 3D chiplet technology, can have multiple chips stacked on top of each other for next-gen CPU dominance.
Ticker During AMD's Computex 2021 keynote earlier today, CEO Dr. Lisa Su made a stunning disclosure that may have major ramifications in the days to come for the computing industry. Dr. Su announced that AMD will be producing 3D-stacked chiplets later this year. These chiplets come with stacked caches called 3D V-cache (vertical cache) that is expected to significantly boost gaming performance. AMD's 3D V-cache allows stacking an additional 64 MB of SRAM cache vertically on top of each core complex die (CCD). For the current Ryzen 5000 series chips such as the Ryzen 9 5900X and the Ryzen...