Applied Materials and A*STAR's Institute of Microelectronics Expand Research Collaboration to Accelerate Heterogeneous Chip Integration with Hybrid Bonding Technology – EEJournal
Organizations sign five-year extension to their R&D engagement, including an expansion of the Applied Materials–Institute of Microelectronics Center of Excellence in Advanced Packaging in Singapore New phase of research aims to accelerate breakthroughs in materials, equipment and process technologies for hybrid bonding and other emerging, 3D chip integration technologies Expansion provides semiconductor and systems companies…
Source: eejournal.com