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System-level testing demand for advanced ICs has been rising. Foundries including TSMC, Intel and Samsung Electronics, as well as OSATs such as ASE Technology, are already involved, according to industry sources.
WinWay Technology, a provider of IC test interface solutions, remains focused on high-performance computing (HPC) chip demand and has rolled out wafer-level co-packaged optics (CPO) solutions jointly developed with customers.
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