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ABF substrate market may regain prosperity in 2024

The ABF substrate market segment is expected to regain prosperity in 2024, buoyed by rising demand for AI servers, according to market sources. ....

Abf Substrate , Advanced Packaging , Si Server , Hips Components , T Ce , Insus Internconnect Technology , Ther Ic Components , Cloud Computing , Unimicron Technology , Chen Ding , Zhen Ding Tech ,

Zhen Ding cautious about 1H23 business prospects

PCB and IC substrate manufacturer Zhen Ding Technology has expressed caution about its business prospects for the first half of this year, citing ongoing inventory adjustments throughout the consumer electronics industry supply chain. ....

Zhen Ding Technology , Hips Components , Consumer Electronics , Ther Ic Components , Supply Chain , Chen Ding ,

Zhen Ding remains upbeat about high-end ABF substrate demand

Zhen Ding Technology s revenue fell 7% year on year in the first quarter of 2023, but the company remains optimistic about high-end ABF substrate demand. ....

Zhen Ding Technology , Abf Substrate , Hips Components , Ther Ic Components , Chen Ding ,

TPCA sets carbon reduction roadmaps for PCB makers in Taiwan

Taiwan s PCB industry will carry out its low-carbon transformation based on three axes of independent energy saving, renewable energy, and negative carbon/carbon trading, aiming to reduce emissions by 30% by 2030 and accomplish the goal of net zero emissions by 2050, according to chairman Maurice Lee of Taiwan Printed Circuit Association (TPCA). ....

Apple Supply Chain , Carbon Reduction , Hips Components , Net Zero , Ther Ic Components , Renewable Energy , Chen Ding ,

PCB makers cautious about spending in 2023

PCB manufacturers will be cautious about spending this year amid the still unfavorable macro outlook, according to industry sources. ....

Hips Components , Geo Satellite , Ther Ic Components , Chen Ding ,