Samsung steps up fan-out wafer-level packaging deployment
Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources.
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Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources.
Vedanta, one of the applicants for India's semiconductor and display fab incentive scheme, is reportedly struggling to secure a technology partner and has divergent views with the government over project cost that may impact the subsidy amount.
Water and electricity shortages are more difficult to manage than rising manufacturing costs, according to sources in Taiwan's IC manufacturing sector.
Wise-integration, a French company specialized in digital control of gallium nitride (GaN) power supplies and GaN ICs, and Powernet, a Korean power supply manufacturer, announced on April 6 an agreement to build compact and energy-efficient technology for power-supply applications that are currently limited to analog control.
The Semiconductor Industry Association (SIA) has announced global semiconductor industry sales totaled US$39.7 billion during the month of February 2023, a decrease of 4% compared to the January 2023 total of US$41.3 billion and 20.7% less than the February 2022 total of US$50 billion.