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SK hynix announces semiconductor advanced packaging investment in Purdue Research Park

SK hynix announces semiconductor advanced packaging investment in Purdue Research Park
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Gov. Holcomb, IEDC announce generational multi-billion-dollar investment to make Indiana leader in semiconductor packaging

Gov. Holcomb, IEDC announce generational multi-billion-dollar investment to make Indiana leader in semiconductor packaging
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SK hynix announces semiconductor advanced packaging investment in Purdue Research Park

WEST LAFAYETTE, Ind., April 03, 2024 (GLOBE NEWSWIRE) SK hynix Inc. announced Wednesday (April 3) that it plans to invest close to $4 billion. ....

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Gov. Holcomb, IEDC announce generational multi-billion-dollar investment to make Indiana leader in semiconductor packaging

WEST LAFAYETTE, Ind., April 03, 2024 (GLOBE NEWSWIRE) Governor Eric J. Holcomb, Secretary of Commerce David Rosenberg and Purdue University P. ....

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SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana

To build advanced packaging facility for next-generation HBM, while collaborating with Purdue University for R&D Selects Indiana for strong support provided by the state and local government, infrastructure for manufacturing, and talent at Purdue. Industry s first investment in advanced packaging for AI products on American soil, strengthens supply-chain resilience SEOUL, South Korea, April 4, 2024 /PRNews. ....

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