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HPCwire: Global News on High Performance Computing (HPC) - Vimarsana News

HPCwire: Global News on High Performance Computing (HPC)

HPC news and supercomputing information focused on emerging HPC applications in science, engineering, financial modeling, virtual reality, databases and other compute intensive tasks

IBM launches new Telum processors - Vimarsana News

IBM launches new Telum processors

IBM has revealed details on its new Telum Processor, the first from the tech giant to contain on-chip acceleration for artificial intelligence inferenci...

Source: crn.com.au
New IBM Telum Processors Show AI Investment 'Down At The Silicon Level' - Vimarsana News

New IBM Telum Processors Show AI Investment 'Down At The Silicon Level'

IBM unveils new Telum processors, which bring AI down to the chip level amid growing demand by businesses for data- and compute-intensive processes.

Source: crn.com
AMD shows off more 3D-stacking technologies at Hot Chips 33 - Vimarsana News

AMD shows off more 3D-stacking technologies at Hot Chips 33

The 3D V-Cache shown off by AMD at Computex is the (relatively) simple addition of further L3 cache to a Ryzen 9 5900X, bringing around a ~15%...

Samsung Joins Google and Nvidia in Using AI to Design Chips - Vimarsana News

Samsung Joins Google and Nvidia in Using AI to Design Chips

Samsung has reportedly started using artificial intelligence features in the Synopsys chip design tool for upcoming processors.

Source: pcmag.com