Applied Materials Technologies Enable 2D Scaling with EUV and 3D Gate-All-Around Transistors
Applied extends 2D EUV logic scaling with Stensar™ CVD alternative to spin-on patterning films Previews broadest portfolio of technologies for 3D Gate-All-Around transistors including two new IMS™ systems SANTA CLARA, Calif., April 21, 2022 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today introduced innovations that help customers continue 2D scaling with EUV and detailed the industry’s…
Source: eejournal.com
