Qualcomm's latest earbud chip is built for Bluetooth LE Audio
December 16th, 2020 Bluetooth SIG At CES in January, Bluetooth SIG announced a spin-off standard for for wireless sound called Bluetooth LE Audio (low-energy). The new framework allows two key features: native support for hearing aids and audio sharing. And, of course, the standard promises higher quality sound while using less power — all thanks to a new Low Complexity Communication Codec (LC3). This means nothing is headphone companies can’t put it in their products, but that will soon be a possibility. Today, Qualcomm announced its QCC305x SoC, a true wireless earbud chip that’s pro...
Source: engadget.com