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A roundup of all the latest electronics news from Embedded World 2019 in Nuremberg.
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A roundup of all the latest electronics news from Embedded World 2019 in Nuremberg.
Sauerlach near Munich, Germany, July 5, 2022 – MicroSys Electronics officially announced support for the new NXP® Semiconductors S32G3 vehicle network processor at embedded world 2022 (booth 4-108), thereby extending the scalability of the NXP S32G-based miriac® System-on-Modules family with massively higher real-time data processing power for mixed-critical safety applications. The new miriac® MPX-S32G399A System-on-Module surpasses…
MicroSys Electronics announced a module built around NXP's S32G3 vehicle network processor at Embedded World 2022. Intended for real-time mixed-critical
Columbia, MD / Munich, Germany, and Tel Aviv, Israel, November 30th, 2021 – NXP Gold partner MicroSys Electronics announced that its new embedded SoM (System-on-Module) platform miriac AIP-S32G274A, which is based on NXP S32G vehicle network processors, now supports Hailo-8 AI accelerator modules. A result of MicroSys’s partnership with leading AI (Artificial Intelligence) chipmaker Hailo the powerful AI solution delivers…
Columbia, MD and Tel Aviv, Israel, September 30th, 2021 – MicroSys Electronics announced today its partnership with leading AI (Artificial Intelligence) chipmaker Hailo to launch its miriac AIP-LX2160A embedded platform hosting up to 5 integrated Hailo-8 AI accelerator modules. The new edge server-grade AI solution enables high-performance and scalable AI inference capabilities at the edge. The new, application-ready AI platform offers industries a…