Backend firms see slow adoption of FC packaging among handset APs
The adoption of advanced fan-out packaging among handset application processors has been sluggish, according to sources at backend houses.
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The adoption of advanced fan-out packaging among handset application processors has been sluggish, according to sources at backend houses.
Chip and component suppliers in the iPhone supply chain are less confident about the initial stocking volume of Apple's forthcoming smartphones, according to industry sources.
China-based smartphone brands' shipments are expected to make a recovery in the second quarter, stimulated by robust demand from the 618 shopping festival, with an on-year decline to also shrink to less than 10%, according to DIGITIMES Research's latest figures from the China smartphone industry report.
MediaTek has expanded its Dimensity portfolio with its new Dimensity 9200+ chipset for flagship 5G smartphones. According to the chipmaker, the new offering builds on the success of its predecessor with a performance upgrade while maintaining power efficiency for longer battery life and better gaming experiences.
Taiwan-based network device makers Arcadyan Technology, Sercomm, and Accton Technology are all keen on their capacity expansions in Southeast Asia despite the existing economic downturn, according to sources from the upstream supply chain.