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Marvell Technology has demonstrated high-speed, ultra-high bandwidth silicon interconnects manufactured using Taiwan Semiconductor Manufacturing Company's (TSMC) 3-nanometer (3nm) process. Marvell's industry-first silicon building blocks in this node include 112G XSR SerDes (serializer/de-serializer), Long Reach SerDes, PCIe Gen 6/CXL 3.0 SerDes, and a 240 Tbps parallel die-to-die interconnect, according to the chip vendor.
Realtek Semiconductor expects the penetration rates of Wi-Fi 6 in PCs to rise to 70% and routers to 60% in 2023, each up 10pp from a year ago, while products supporting Wi-Fi 7 are unlikely to begin volume shipments until 2024-2025 as the standard is still being certified.
The midair explosion of a SpaceX Starship rocket soon after launch in a test flight has come as a setback to the low Earth orbit (LEO) satellite market though it remains rosy in the long term.
With iPhones accounting for four of the top-five models in terms of unit sales in the first quarter of 2023, Apple is undoubtedly the most popular brand in the OLED smartphone business, according to media reports.
Broadband communication technologies such as LTE Cat.1bis and 5G NR-Light are gaining the attention of IoT chip developers for their new products with the phasing away of 2G and 3G networks, while IoT chips with RISC-V architecture have grown popular among Chinese chip suppliers, according to DIGITIMES Research's latest finding in the IoT chip industry.