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Davos 2024: Have about 170 Gen AI labs, says HCLTech chairperson Roshni Nadar Malhotra - Vimarsana News

Davos 2024: Have about 170 Gen AI labs, says HCLTech chairperson Roshni Nadar Malhotra

On partnering Taiwan's Foxconn for chip packaging and testing facility, Malhotra tells Moneycontrol it is early days and the location is yet to be chosen

Cabinet okays pact with EU on chip technology - Vimarsana News

Cabinet okays pact with EU on chip technology

The MoU, signed on November 21, 2023, intends to strengthen cooperation between India and European Union (EU) towards enhancement of semiconductor technology for the advancement of Industries and digital technologies, according to an official statement.

'We have a certain DNA': HCL's Roshni Nadar on JV with Foxconn for chip packaging and testing facility in India - Vimarsana News

'We have a certain DNA': HCL's Roshni Nadar on JV with Foxconn for chip packaging and testing facility in India

HCL has certain DNA and understands the chip ecosystem, said HCLTech's Roshni Nadar

HCL Group, Foxconn partner for chip testing plant in India | - Vimarsana News

HCL Group, Foxconn partner for chip testing plant in India |

Apple supplier Foxconn and HCL Group have announced a partnership to establish a semiconductor assembly and testing facility in India. The joint venture aims to build an ecosystem and foster supply chain resilience for the domestic industry. Read more about the collaboration here.

Davos 2024: 'Micron India plant to roll out first chip by December 2024,' says IT minister Ashwini Vaishnaw - Vimarsana News

Davos 2024: 'Micron India plant to roll out first chip by December 2024,' says IT minister Ashwini Vaishnaw

Micron made the semiconductor investment announcement in Jun 2023 and actual construction started in September 2023. "It's how many days? 90 days, it's a record for anywhere else in the world," the minister said.