Page 8 - Semiconductor Engineering Inc News Today : Breaking News, Live Updates & Top Stories | Vimarsana

Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company today announced the formation of an industry consortium that will establish a die-to-die interconnect standard and foster an open chiplet ecosystem.

A group of top chip companies has developed the Universal Chiplet Interconnect Express standard, or UCIe, to help create modular chips that would act like today's PCs but at the chip level.

A consortium of tech industry heavyweights today announced the Universal Chiplet Interconnect Express (UCIe) industry consortium with a mission to [...]

Remember how AMD and Intel co-created the "Kaby Lake G" chip? UCIe would theoretically allow virtually any chip company to do the same.

A new industry consortium – Universal Chiplet Interconnect Express (UCIe) – has formed to establish a die-to-die interconnect standard in support of an