Mold-Tek raises Rs 103.6 cr through QIP issue ; receives good response from marquee investors
Uniindia: Hyderabad, Dec 23 (UNI) Mold-Tek Packaging Limited has raised Rs 103.6 crore through its QIP ( Qualified Institutional Placement) issue at Rs 740 per equity which is 2.44 per cent more than the floor price of Rs 722.40.