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integrated Secure Element (iSE) for multiple applications - Hardware Security Module (HSM) - Security Enclave

integrated Secure Element (iSE) for multiple applications - Hardware Security Module (HSM) - Security Enclave - Security Subsystem
As part of Secure-IC s iSSP (integrated Security Service Platform), Secure-IC is able to provide integrated Secure Elements (iSE) that can act as trust anchors that protect the security assets of a device. An iSE - also referred as HSM or Security Subsystem or Root of Trust - is an IP block that can be embedded into every device to ensure security services such as key management, lifecycle management, Secure Boot & updates
Secure-ICâs Securyzr provides the core security services required to build a security architecture for a wide variety of devices and connected objects: mobile, payment device, smart card, ECU, Set-Top-Box, and HSM. ....

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TCG welcomes new member Goldman Sachs as it focuses on FinTech security for the first time

TCG welcomes new member Goldman Sachs as it focuses on FinTech security for the first time
Media
Links
Beaverton, OR, USA, February 22, 2021 – Trusted Computing Group (TCG) has today announced its commitment to strengthening the financial services industry against attack, as worldwide banking institution, Goldman Sachs, joins TCG in the fight for cybersecurity.
In a first for TCG, the organization will now expand its focus to include the fast-moving innovation of FinTech. With mobile transactions projected to grow by 121 percent over the next year, this is fast becoming a new area of concern for security experts, where essential transactions must be kept safe and secure. ....

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信息系统安全 总结提纲_鸭梨儿的博客-CSDN博客

信息系统安全总结提纲_鸭梨儿的博客-CSDN博客
csdn.net - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from csdn.net Daily Mail and Mail on Sunday newspapers.

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Tachyum Closes Milestone Year for Development of Prodigy Universal Processor – Consumer Electronics Net

3 months ago
LAS VEGAS–(BUSINESS WIRE)–Tachyum
™ Inc. celebrates another year of milestones for the company and its Prodigy Universal Processor development, including several demonstrations, design achievements, and other proof-of-product successes. Its progress in 2020 has positioned Prodigy for volume manufacturing and worldwide commercial distribution in 2021.
Its most significant accomplishment on the path to market-readiness was the recent release of a fully functional FPGA chip prototype, the last step before tape-out when final design specs are submitted for fabrication. Tachyum will have 98 percent of the complete Prodigy chip layout, the verified detailed physical design of the silicon area, by December 31.
Throughout the year Tachyum proved Prodigy’s capabilities in demonstrations such as software emulation testing across x86, ARM and RISC-V binary environments, running a web server application on Prodigy using a mi ....

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Intel Announces New Optane Drives, 3D NAND SSDs

ExtremeTech
Intel Announces New Optane Drives, 3D NAND SSDs
By Joel Hruska on December 17, 2020 at 11:02 am
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Intel has announced a wave of new storage products intended for multiple markets, from enterprise to consumer hardware. There’s a lot of new drives being announced, including:
SSD D7-P5510: Data center drive using NVMe, built with 144-layer TLC
SSD D5-P5316: Data center drive using NVMe, built with 144-layer QLC
SSD 670p: Consumer drive using NVMe, built with 144-layer QLC.
And the Optane drives:
Optane SSD P5800X: Data center drive, 2nd Gen Optane ....

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