DuPont's GreenTape LTCC based AiP can replace PCB antennas for 5G

DuPont Microcircuit and Component Materials (MCM) and ITRI in Taiwan are collaborating in bringing a new material GreenTape LTCC (Low Temperature Co-fired Ceramics) material to market for use in AiP (Antenna in Package) applications as an alternative to existing Print Circuit Board (PCB) options.

Related Keywords

Taiwan ,Industrial Technology Research Institute ,Kao Hsiung ,Tzong Ming Lee ,Dupont Greentape ,Del Mar Electronics Manufacturing Show ,Chemical Research Laboratories ,Pont Microcircuit ,Component Materials ,Low Temperature Co Fired Ceramics ,Print Circuit Board ,Dupont Microcircuit ,Technology Research Institute ,Del Mar Electronics ,Manufacturing Show ,Radio Frequency Front End Modules ,Radio Frequency Front End ,Yu Ling Hsiao ,Chemical Research , ,