Intel 3D Stacked CMOS Transistors Combine Backside Power & Direct Backside Contact To Deliver Increased Performance & Scaling For Next-Gen Chips

Intel showed 3D Stacked CMOS Transistor technology, utilizing backside power & direct backside contact to deliver more performance & scaling.

Related Keywords

,Intel Corporation ,Components Research ,Intel Components Research ,Intel ,Why It Matters ,Foveros Direct ,