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Murata used a combo WiFI6 and Bluetooth 5.3 chipset from NXP Semiconductor for a compact 2 x 2 MIMO module that measures 19.1 mm x 16.5 mm x 2.1 m for embedded designs. The Type 1XL module uses proprietary packaging and miniaturization technologies around the NXP 88W9098 combo chipset. This supports IEEE 802.11a/b/g/n/ac/ax 2×2 multi-user, […]

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Akira Sasaki ,Iot Module Department At Murata ,Iot Module Department ,

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