Xilinx expands UltraScale+ portfolio

Xilinx expands UltraScale+ portfolio
Xilinx has announced that it is expanding its UltraScale+ portfolio for markets with new applications that require ultra-compact and intelligent edge solutions.
With form factors that are 70 percent smaller than traditional chip-scale packaging, the Artix and Zynq UltraScale+ devices will be able to address a wider range of applications within the industrial, vision, healthcare, broadcast, consumer, automotive, and networking markets.
Based on 16 nanometer technology, Artix and Zynq UltraScale+ devices are available in TSMC’s state-of-the-art InFO (Integrated Fan-Out) packaging technology. Using InFO, both devices meet the need for intelligent edge applications by delivering high-compute density, performance-per-watt, and scalability in compact packaging options.

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