Week In Review: Manufacturing, Test
UMC expands; Ford’s chip woes; ASE ups CapEx; phone shakeup.
Chipmakers and OEMs
Several foundry vendors are expanding their fab capacity. The latest is
UMC, which announced plans to expand capacity at its 300mm Fab 12A Phase 6 (P6) in Taiwan’s Tainan Science Park.
UMC has operated in the Tainan Science Park since 1999, when Fab 12A was established as Taiwan’s first 300mm fab. Fab 12A is currently operating at a capacity of approximately 90,000 300mm wafers per month (wpm), with an additional 10,000 wpm being installed at P5 starting in 2021.
The P6 project will add 27,500 more wpm production capability when fully equipped. P6 will be equipped with fab tools, enabling 28nm processes with the flexibility to produce smaller nodes down to 14nm. The P6 expansion is scheduled for production in the second quarter of 2023, with total investment for the project earmarked at NT$100 billion (US$3.6 billion). In addition to UMC’s previously ann
9Spokes poised for growth off the back of increased interest in SMB digitalisation
The company is pursuing several market opportunities to leverage its platform into core banking applications to facilitate loan origination and loan management. Cash balance at the end of the March quarter was $9.27 million.
9Spokes International Ltd (ASX:9SP) experienced strong pipeline growth in the March quarter off the back of its regional sales focus, which incorporates direct sales teams and partners.
This strategy has already resulted in a strengthened direct and partners sales pipeline with a number of opportunities at varying stages – including five qualified opportunities.
During the quarter the company announced a Framework Services Agreement with Clydesdale Bank Plc, a subsidiary of Virgin Money UK PLC, and a first Statement of Work to determine project scope for a working capital health proposition.
Quarterly Results
Earnings per share fell 26.67% year over year to ($0.57), which missed the estimate of ($0.56).
Revenue of $240,929,000 declined by 45.97% year over year, which beat the estimate of $239,830,000.
Outlook
Revenue guidance hasn t been issued by the company for now.
Details Of The Call
Time: 10:00 AM
North American Semiconductor Equipment Industry Posts March 2021 Billings
North America-based semiconductor equipment manufacturers posted $3.27 billion in billings worldwide in March 2021 (three-month average basis), according to the March Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 4.2% higher than final February 2021 billings of $3.14 billion and 48% higher than March 2020 billings of $2.21 billion.
“Fueled by strong demand for leading-edge technologies, billings of North America-based semiconductor equipment manufacturers continued to edge up in March to set a new historical high,” said Ajit Manocha, SEMI president and CEO.
The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.
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