Foxconn Partners With HCL To Set Up Chip Packaging Unit In India
Foxconn and HCL Group are set to enter a joint venture to set up a chip packaging and testing facility in India, as the long-time Apple partner diversifies from China. Foxconn Hon Hai Technology India Mega Development, a subsidiary of the Taiwanese parent Foxconn, will invest $37.2 million for a 40% stake, it disclosed in a Taiwan Stock Exchange filing. Rest of the stake will be held by HCL. The two entities will together set up a outsourced semiconductor assembly and testing facility.
Young Liu Foxconn Hon Hai Technology India Mega Development Information Technology Rajeev Chandrasekhar Taiwan Stock Exchange Apple Inc Foxconn Group
Source: ndtvprofit.com