Adaptive Structures News Today

Purdue University researchers have developed a patent-pending method to add particles to filament and disperse them evenly through a traditional fused deposition modeling, or FDM, 3D printer, which will aid industry in manufacturing functional parts.

The technique embeds sensor particles in the 3D-printing filament, expanding the design envelope for fully functional parts in a range of shapes.

Professor Senol Utku was deeply involved in the education and mentorship of civil engineering students throughout his career at Duke Engineering

WASHINGTON

Date Time Share Pentagon Science and Technology Executive Committee Announces Winner of FY21 Applied Research for Advancement of S&T Priorities U.S. Department of Defense The Department of Defense (DoD) Science and Technology Executive Committee (S&T ExCom), coordinated by the Office of the Under Secretary for Research and Engineering (OUSD(R&E)), is proud to announce the winner of the 2021 Applied Research for Advancement of S&T Priorities (ARAP) Program Award Competition. “After careful de...

Home » Electronics & Semiconductors » Fatigue strength of hybrid joined multi-material structures: Fraunhofer LBF identifies high potential for lightweight design Fatigue strength of hybrid joined multi-material structures: Fraunhofer LBF identifies high potential for lightweight design Posted by PublisherElectronics & Semiconductors Thursday, 21. January 2021 Increasingly stringent statutory emission limits are pushing the automotive industry toward innovative lightweight design solutions. ...

Beyond batteries: Inside the latest innovation poised to power our smart wearables Beyond batteries: Inside the latest innovation poised to power our smart wearables HONG KONG, Dec. 15, 2020 — When it comes to moving the needle forward in technological innovation, The Chinese University of Hong Kong (CUHK) continues to lead the way among Asia-Pacific universities. With a faculty of researchers and professors dedicated to solving practical problems and meeting modern challenges head-on, CUHK h...

(1) HONG KONG, Dec. 15, 2020 (GLOBE NEWSWIRE) -- When it comes to moving the needle forward in technological innovation, The Chinese University of Hong Kong (CUHK) continues to lead the way among Asia-Pacific universities. With a faculty of researchers and professors dedicated to solving practical problems and meeting modern challenges head-on, CUHK has generated a portfolio of top-class technology. Its most recent endeavor? Time itself, so to speak. Developed by Professor Wei-Hsin Liao, the ...