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April 18, 2024
Latest News from the Electronics Industry - Electropages
August 16, 2023
Adlink Technology expands its product portfolio of COM-HPC computer on modules. The »COM-HPC-cRLS« is based on Intels 13th generation of Core CPUs and comes with Size C form factor of the COM-HPC standard.
August 10, 2023
Adlink Technology introduces its new Development Kit for SMARC. It is bases on a SMARC module from Adlink with a MediaTek CPU. Adlink focuses particularly on the use for AI applications and robotics.
August 9, 2023
Adlink Technology introduces its new Development Kit for SMARC. It is bases on a SMARC module from Adlink with a MediaTek CPU. Adlink focuses particularly on the use for AI applications and robotics.
July 19, 2023
The Global Sensor Interface Junction Box Market exhibits comprehensive information that is a valuable source of insightful data for business strategis
February 7, 2023
New sensors and greater incorporation of artificial intelligence are not only improving machine vision capabilities, they’re also making them easier to implement and operate.
December 8, 2022
Panel PCs embed complete single board computing functionality, providing a complete embedded solution. To display information and enable user control.
November 10, 2022
WAKEFIELD, Mass. The PICMG consortium has ratified the new COM Express 3.1 specification to support high-speed serial interfaces such as PCIe Gen 4 and USB4.
November 4, 2022
/PRNewswire/ -- Whats New for 2022? Global competitiveness and key competitor percentage market shares Read the full report:...
January 18, 2022
We’re now entrenched in an era where artificial intelligence (AI) is easily done at an embedded systems level. That means system developers can implement local AI decision-making right at the IoT edge using box-level systems.