Advanced Packaging Laboratory News Today : Breaking News, Live Updates & Top Stories | Vimarsana

Samsung Electronics has recently expanded its workforce deployment at its new packaging R&D base in Yokohama, Japan, to expedite construction and support the development of next-generation semiconductor packaging technologies.

South koreaSouth koreanMinato miraiBg fundPackaging laboratorySamsung electronicsAdvanced packaging laboratoryAdvanced packagingHigh bandwidth memoryShinko electric