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Driven by AI boom, TSMC to invest $2.9 billion in advanced chip plant in Taiwan

TAIPEI (Reuters) -Driven by a surge in demand for artificial intelligence, Taiwanese chip maker TSMC plans to invest nearly T$90 billion ($2.87 billion) in an advanced packaging facility in northern Taiwan, the company said on Tuesday. "To meet market needs, TSMC is planning to establish an advanced packaging fab in the Tongluo Science Park," the company said in a statement. CEO C.C. Wei said last week that TSMC is unable to fulfil customer demand driven by the AI boom and plans to r...
Miaoli Xian T Ai Pei Yimou Lee Sarah Wu Kim Coghill Nvidia Corp
Source: yahoo.com

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Global 3D Semiconductor Packaging Strategic Market Report 2023: Market to Reach $27 Billion by 2030 - 3D Chip Stacking Technology to Drive Future Advanced Packaging Technology

/PRNewswire/ -- The "3D Semiconductor Packaging: Global Strategic Business Report" report has been added to ResearchAndMarkets.coms offering. Global 3D...
Laura Wood Semiconductor Industry Consumer Electronics World Iot Semiconductors Market Semiconductor Packaging Semiconductor Advanced Packaging

Camtek (NASDAQ:CAMT) Reaches New 52-Week High at $33.31

Shares of Camtek Ltd. (NASDAQ:CAMT – Get Rating) hit a new 52-week high during trading on Tuesday . The company traded as high as $33.31 and last traded at $32.88, with a volume of 22847 shares trading hands. The stock had previously closed at $32.92. Analyst Upgrades and Downgrades A number of analysts have recently […]
United States Zurcher Kantonalbank Zurich Cantonalbank Sunbelt Securities Inc America Corp Camtek Ltd Camtek Company Profile

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