Page 8 - Benzinga Pro News Today

The event drew approximately 4,000 Taiwanese attendees, who came to celebrate not only the game but also Taiwan Heritage Day.

Nvidia's appeal is that its products are required by others to executive on their AI plans, Navellier said.

On Wednesday, NIO shares trade lower premarket, amid 30% loss in six months, and BofA Securities analyst lowering price target to $5.9.

Nvidia Corp (NASDAQ:NVDA) plans to use Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips earlier than scheduled to address the production constraints of Chip on Wafer on Substrate (CoWoS) packaging at Taiwan Semiconductor Manufacturing Co (NYSE:TSM). Industry insiders see FOPLP as a viable alternative to CoWoS due to TSMC’s limited CoWoS capacity and the rising demand for AI chips driven by generative AI applications. A senior executive from China Wafer Level ...

ReShape Lifesciences reported that it gained approval from the United States Patent and Trademark Office for its application entitled, "Intragastric Device (For Treating Obesity)." In the patent filings, the company described the product as a swallowable implant that expands via a balloon in the stomach to induce a feeling of fullness, helping to restrict food intake.