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Simplifying COM-HPC designs

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New Electronics - congatec simplifies COM-HPC designs

New Electronics - congatec simplifies COM-HPC designs
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Christian ederModule base specificationBase specificationCarrier board design guidePlatform management interfaceDesign guideDirector marketingGen intel coreAlder lakeIntel xeon

COM-HPC Carrier Design Guide compliant ecosystem

San Diego, CA, 10 February, 2022 congatec – a leading vendor of embedded and edge computing technology – welcomes the publication of the COM-HPC Carrier Board Design Guide by the PCI Industrial Computer Manufacturers Group (PICMG) with the launch of a fully specification compliant ecosystem for engineers of COM-HPC Client and Server module based designs.…

San diegoUnited statesChristian ederModule base specificationIndustrial computer manufacturers groupBoard design guideComputer manufacturers groupBase specificationCarrier board design guidePlatform management interfaceDesign guideDirector marketingGen intel coreAlder lakeIntel xeon

The COM-HPC roadmap: »2022 will be the server year«

Christian Eder knows his way around computer module standards. He has actively contributed to the success of COM-HPC. How COM-HPC will continue and what it has to do with servers, he explains in an interview with Elektronik.

Christian ederDirector marketingForce computersPlatform management interfaceCarrier board design guide

PICMG releases brand new COM-HPC Carrier Board Design Guide

Wakefield, MA., USA, January 2022 – PICMG, a leading consortium for developing open embedded computing specifications, announces that the COM-HPC Carrier Board Design Guide is released and freely available on the PICMG website. The 160-page document provides electronics engineers and PCB layout engineers comprehensive information for designing custom system carrier boards for COM-HPC modules. COM-HPC –…

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