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Hyderabad (Telangana) [India], January 10 (ANI/BusinessWire India): Ceremorphic, a fabless silicon and system development company, today announced an expansion of its business to include a new business model for the high-performance computing (HPC) industry. Leveraging the company's proven expertise in developing chips in 5nm and below for AI supercomputing and other HPC applications, Ceremorphic will now also offer its IP and design expertise to develop advanced ICs for select customers looking to differentiate their business with customized silicon. For more information, refer to the new "Custom Engineering" page on the Ceremorphic website. The development cycle for advanced, lower-geometry silicon devices is lengthy and costly due to the complex IP and expertise required, even for well-resourced system companies. To solve this problem, Ceremorphic has been working on infrastructure IP for high-performance AI supercomputing for many years and has successfully tested its

Andhra pradeshVenkat mattelaSubhasish mitraComputer science at stanford universityBusinesswire indiaElectrical engineeringComputer scienceHyderabad telangana indiaAnuary 10 ani businesswire india ceremorphicA fabless silicon and system development companyOday announced an expansion of its business to includea new model for the high performance computing hpc industry leveraging company 39s proven expertise in developing chips 5nm and below ai supercomputing other applicationsEremorphic will now also offer its ip and design expertise to develop advanced ics for select customers looking differentiate their business with customized silicon more informationEfer to the new quot custom engineering page on ceremorphic website development cycle for advancedOwer geometry silicon devices is lengthy and costly due to the complex ip expertise requiredVen for well resourced system companies to solve this problemEremorphic has been working on infrastructure ip for high performance ai supercomputing many years and successfully tested its design methodology witha 5nm device tape out in 2022 the company also developed new methods connectivity