Renesas’ Modular IoT Development Platform reduces time-to-market and design complexity Friday, 09 July 2021 12:46 Renesas’ Modular IoT Development Platform reduces time-to-market and design complexity
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Renesas a supplier of semiconductor solutions, introduced a new IoT system design platform that eases the prototyping of IoT systems.
The Renesas Quick-Connect IoT system consists of standardised boards and interfaces, enabling designers to quickly and easily connect a wide range of sensors to MCU development boards. The new system also delivers core software building blocks that are portable between boards, greatly reducing coding requirements.
Renesas senior director of the systems and solutions team DK Singh said, “We are laser focused on delivering solutions that enable customers to get to market faster with superior end products.
Renesas New Modular IoT Development Platform Dramatically Reduces Time-to-Market and Design Complexity – EEJournal
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Highlights
The SIM7070 series from SIMCom is an NB-IoT module in a compact footprint (24 mm x 24 mm) combining GSMA-compliant eSIM remote management from Kigen with a best-in-class eSIM security controller from Infineon optimized for space-constrained and industrial applications.
SIMCom, Kigen and Infineon have announced the module s immediate availability, even as a first in Europe.
The single certified eSIM-enabled product allows OEMs and MVNOs to ease manufacture and logistics for the acceleration of massive IoT so as to quickly scale to millions of devices in the field, regardless of location.
SHANGHAI, June 28, 2021 /PRNewswire/ SIMCom, the leading designer and manufacturer of Machine-to-Machine (M2M) wireless modules and solutions, announced that the SIMCom NB-IoT SIM7070 module measuring only 24 mm x 24 mm can now be equipped with a compact eSIM security controller from Infineon powered by GSMA-compliant remote SIM management software provided b