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DoD awards $120 million for FOWLP semiconductor packaging

DoD awards $120 million for FOWLP semiconductor packaging
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United statesSkywater technologyUs department of defense doDeca technologiesOsceola countyRe shore ecosystemSecure heterogenous advanced packaged electronicsScience act

SkyWater Florida and Deca Technologies Announce $120M DOD Award to Expand Advanced Packaging Capabilities in Osceola County, Florida

SkyWater is the first domestic provider of Deca’s M-Series™ fan-out and Adaptive Patterning® technologies to support the reshoring of the semiconductor supply chain .

United statesDon fisherMatt walshTim olsonDeca genThomas sondermanDale millerRaja swaminathanSkywater technology forwardSkywater technologyEcosystem for secure heterogeneous advanced packaged electronicsProgram awardDepartment of defenseService taaBiden harris administrationDeca technologies

SkyWater Florida and Deca Technologies Announce $120M DOD Award to Expand Advanced Packaging Capabilities in Osceola County, Florida

SkyWater Florida and Deca Technologies Announce $120M DOD Award to Expand Advanced Packaging Capabilities in Osceola County, Florida
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United statesDale millerMatt walshTara lutherSandy fewkesLori mcdonaldTim olsonDeca genThomas sondermanDon fisherLauri julianRaja swaminathanBiden harris administrationSkywater company contactSkywater technology forwardProgram award

Fan-Out Wafer Level Packaging Market to exceed $5Bn by

Fan-Out Wafer Level Packaging Industry size is expected to register 10% CAGR between 2023 and 2032 propelled by the growing penetration of miniaturized.

United statesSiliconware precision industries co ltdGlobal market insights incBrowse our reportsNepes corporationTechnology holding co ltdAmkor technologyGlobalfoundries incGroup co ltdPowertech technology incOut wafer level packaging marketGlobal market insightsFan out wafer level packagingDensity packagingDeca technologiesReports store

Fan-out Wafer Level Packaging Market size to grow by USD 3,064 31 million from 2022 to 2027; Growth driven by growing use of semiconductor ICs in IoT

/PRNewswire/ The fan-out wafer level packaging market size is set to grow by USD 3064.31 million from 2022 to 2027 progressing at a CAGR of 17.5% during the.

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