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Chip Assembly: Behind the scenes: Inside Intel s advanced chip packaging, assembly, and testing facilities in Malaysia
Intel recently provided a tour of its chip packaging, assembly, and testing facilities in Malaysia. The Penang Assembly and Test (PGAT) facility assem
Pulau pinang
Penang assembly
Manufacturing services
Design and development lab in penang
Intel kulim die sort prep
Die sort prep
System integration
High density modular tester
System level tester
Chip attach
Integrated heat spreader
Design and development lab
Penang assembly and test
Kulim die sort prep
Intel malaysia
Chip testing
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